Semiconductor device, associated method and layout
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShih-Wei Peng, Hui-Ting Yang, Wei-Cheng Lin, Jiann-Tyng Tzeng
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShih-Wei Peng, Hui-Ting Yang, Wei-Cheng Lin, Jiann-Tyng Tzeng
Estimating the term…
A semiconductor device includes gate strips, first metal strips and second metal strips. The first metal strips are formed above the gate strips. The first metal strips are co-planar, and each first metal strip and one of the gate strips are crisscrossed. The second metal strips are formed above the first metal strips. The second metal strips are co-planar, and each second metal strip and one of the first metal strips are crisscrossed. One first metal strip connects to one gate strip crossing underneath by a first contact via without connecting to one second metal strip crossing over. A length between two adjacent gate strips is twice as a length between two adjacent second metal strips, and a length of said one first metal strips is smaller than two and a half times as the length between two adjacent gate strips.
A semiconductor device, comprising:
8-15. (canceled)
A layout of an integrated circuit (IC), wherein the layout is stored on a non-transitory computer-readable medium, comprising:
A layout of an integrated circuit (IC), wherein the layout is stored on a non-transitory computer-readable medium, comprising:
The layout of claim 28, wherein a length between the first row and the second row ranges from about 60 to 150 nanometer(nm).
Dependencies are inferred from the claim text.