Vias for package substrates

A method for forming a semiconductor device, comprising:

• forming a via pad at least partially in a core layer;
• forming a first dielectric layer having a first dielectric material above the via pad and the core layer;
• forming a first through hole that is through the first dielectric layer to reach the via pad;
• forming a second dielectric layer having a second dielectric material at least partially filling the first through hole;
• forming a second through hole that is through the second dielectric layer to reach the via pad;
• and
• forming a via within the second through hole of the second dielectric layer, surrounded by the second dielectric material, and in contact with the via pad.

A computing device, comprising:

• a semiconductor die;
• a printed circuit board (PCB);
• and
• a package substrate between the semiconductor die and the PCB, wherein the package substrate includes:
• a via pad at least partially in a core layer;
• a first dielectric layer having a first dielectric material above the via pad and the core layer, wherein the first dielectric layer has a first through hole that is through the first dielectric layer to reach the via pad;
• a second dielectric layer having a second dielectric material at least partially filling the first through hole, wherein the second dielectric layer has a second through hole that is through the second dielectric layer to reach the via pad;
• and
• a via within the second through hole of the second dielectric layer, surrounded by the second dielectric material, and in contact with the via pad.