US 2020/0395263 A1 · SEMICONDUCTOR PACKAGE

Abstract

A semiconductor package includes a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface disposed to oppose the active surface, a heat dissipation member, disposed on the inactive surface of the semiconductor chip, having a plurality of holes and including a graphite-based material, an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member, and a connection member, disposed on the active surface of the semiconductor chip, including a redistribution layer electrically connected to the connection pad. 0<b<0.6a, in which “a” denotes a planar area of the heat dissipation member and “b” denotes a sum of planar areas of the plurality of holes on a plane.

Claims20

Dependent claims

A semiconductor package comprising:

a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface disposed to oppose the active surface;
a heat dissipation member disposed on the inactive surface of the semiconductor chip having a plurality of holes, and including a graphite-based material;
an encapsulant covering at least a portion of each of the semiconductor chip and the heat dissipation member;
and
a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad,
wherein 0<b<0.6a, in which “a” denotes a planar area of the heat dissipation member and “b” denotes a sum of planar areas of the plurality of holes on a plane.

3 more elements

Dependencies are inferred from the claim text.

Semiconductor package

Life of this patent

Semiconductor package

Life of this patent

Abstract

Claims20