US 2020/0395262 A1Published application

Radio-frequency module

AssigneeMurata Manufacturing Co., Ltd.

InventorsTadashi Nomura, Takafumi Kusuyama, Yoshitaka Echikawa

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Abstract

A radio-frequency module 1a includes a wiring board 2, a first component 3a mounted on a lower surface 2a of the wiring board 2, a plurality of connection terminals 4, a first sealing resin layer 5 that covers the first component 3a and the connection terminals 4, a plurality of second components 3b mounted on an upper surface 2b of the wiring board 2, a second sealing resin layer 6 that covers the second components 3b, and a shield film 7. By adjusting surface roughness of a lower surface 5a of the first sealing resin layer 5, surface roughness of a lower surface 30a of the first component 3a, and surface roughness of a lower surface 4a of the connection terminal 4, it is possible to prevent abnormal deposition of plating and a crack in the first component 3a, and to prevent malfunction of the radio-frequency module 1a.

Claims13

Dependent claims

A radio-frequency module comprising:

a wiring board;
at least one first component mounted on one main surface of the wiring board;
a first sealing resin layer having a contact surface, a facing surface and side surfaces, the contact surface being in contact with the one main surface of the wiring board, the facing surface facing the contact surface, each of the side surfaces connecting an edge of the contact surface and an edge of the facing surface to each other, and the first sealing resin layer sealing the first component;
and
at least one connection terminal embedded in the first sealing resin layer,
wherein an opposite surface on a side opposite to a mounting surface of the first component is exposed from the facing surface of the first sealing resin layer,
one end of the connection terminal is connected to the one main surface of the wiring board, and another end of the connection terminal is exposed from the facing surface of the first sealing resin layer, and
a surface roughness of the opposite surface of the first component is smaller than a surface roughness of the other end of the connection terminal, and a surface roughness of the facing surface of the first sealing resin layer is smaller than a surface roughness of the opposite surface of the first component.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/004,454Filed 27 Aug 2020
Priority: JP 2018-05232320 Mar 2018
Published: 17 Dec 2020
Term ends: Not estimatedThe source records don’t support an estimate.

Classification16 codes

H10W 74/114
The semiconductor body being completely enclosed: by a substrate and the encapsulations
H10W 74/141
The semiconductor body being only partially enclosed: the encapsulations being on at least the sidewalls of the semiconductor body
H10W 42/20
Arrangements for protection of devices: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
H10W 42/276
Characterised by their shapes or dispositions: the arrangements being on an external surface of the package, e.g. on the outer surface of an…

Family

Application17/004,454Continuation
US 11,270,922 B2Related patent
US 2020/0395262 A1This patent

From the US filing history. Foreign family members aren’t listed.

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