Back to results
US 2020/0395259 A1Published application
Semiconductor device
AssigneeDenso Corporation
InventorSyuhei Miyachi
Life of this patent
Estimating the term…
Abstract
A semiconductor device is to be mounted on a mount object by a solder. The semiconductor device includes a semiconductor element, an insulation member, and a plurality of terminals. The semiconductor element includes a plurality of electrodes. The insulation member covers the semiconductor element. The plurality of terminals is electrically connected to the plurality of electrodes. At least a part of the plurality of terminals is exposed outside the insulation member.
Claims5
A semiconductor device to be mounted on a mount object by a solder, the semiconductor device comprising:
- a semiconductor element that includes a plurality of electrodes;
- an insulation member that covers the semiconductor element;
- and
- a plurality of terminals electrically connected to the plurality of electrodes, and at least a part of the plurality of terminals exposed outside the insulation member, wherein:
- each of the plurality of terminals has a lower surface to be connected to the mount object;
- and
- at least one of the plurality of terminals includes a recess or a protrusion on the lower surface.
4 more elements
Dependencies are inferred from the claim text.