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US 2020/0395256 A1Published application
Semiconductor package and semiconductor apparatus
AssigneeKorea Advanced Institute of Science and Technology
InventorsEung chang LEE, Heeyoub KANG, Haejung YANG, Youngrok OH, Kitaek LEE, Bong jae LEE
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Abstract
A semiconductor package includes a semiconductor chip and a polydimethylsiloxane (PDMS) layer that is provided on the semiconductor chip and of which upper surface is exposed to the outside. Since the semiconductor package may include the PDMS layer, heat emitting performance of the semiconductor package in a vacuum state may improve.
Claims20
A semiconductor package comprising:
- a semiconductor chip;
- and
- a polydimethylsiloxane (PDMS) layer that is provided on the semiconductor chip,
- wherein an upper surface of the PDMS layer is exposed to the outside of the semiconductor package.
1 more element
A semiconductor package comprising:
- a semiconductor chip;
- a heat sink on the semiconductor chip;
- and
- a polydimethylsiloxane (PDMS) layer that is provided on the heat sink,
- wherein an upper surface of the PDMS layer is exposed to the outside of the semiconductor package.
2 more elements
A semiconductor apparatus comprising:
- a substrate;
- semiconductor chips mounted on the substrate;
- a controller mounted on the substrate and configured to control the semiconductor chips;
- a housing configured to surround the semiconductor chips and the controller;
- and
- an internal polydimethylsiloxane (PDMS) layer on an internal wall of the housing.
3 more elements
Dependencies are inferred from the claim text.