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US 2020/0395243 A1Published application
Multilayer wiring forming method and recording medium
AssigneeTokyo Electron Limited
InventorMitsuaki Iwashita
Life of this patent
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Abstract
A multilayer wiring forming method includes filling a via, which is formed in an insulating film including an oxide film formed on a wiring of a substrate and is extended to the wiring, by forming an electroless plating film, which does not diffuse into the oxide film, from a bottom surface of the via while using the wiring, which is exposed at the bottom surface of the via, as a catalyst.
Claims8
A multilayer wiring forming method, comprising:
- filling a via, which is formed in an insulating film including an oxide film formed on a wiring of a substrate and is extended to the wiring, by forming an electroless plating film, which does not diffuse into the oxide film, from a bottom surface of the via while using the wiring, which is exposed at the bottom surface of the via, as a catalyst.
A multilayer wiring forming method, comprising:
- filling a via, which is formed in an insulating film including an oxide film formed on a wiring of a substrate and is extended to the wiring, by forming an electroless plating film, which does not diffuse into the oxide film, from a bottom surface of the via while using a barrier film, which is exposed at the bottom surface of the via, as a catalyst.
Dependencies are inferred from the claim text.