Electronic antenna module optimised for a chip card with a dual communication interface
AssigneeSmart Packaging Solutions
InventorsBernard CALVAS, Guillaume GERIN, Kevin FABRIZIO
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AssigneeSmart Packaging Solutions
InventorsBernard CALVAS, Guillaume GERIN, Kevin FABRIZIO
Estimating the term…
An electronic module for a smart card has on a first face a terminal block of electrical contacts for contact with corresponding contacts of a card reader, and on a second face an antenna and a microelectronic chip within an encapsulation zone and provided with contact and contactless communication interfaces. The antenna has a plurality of turns at the periphery of the module and a proximal connection pad and a distal connection pad inside the encapsulation zone for connection to corresponding terminals of the contactless communication interface. The distal connection pad is located a short distance d from the edge of the encapsulation zone, and the internal edges of connection wells of the two contacts closest to the distal connection pad are spaced outward from the module relative to the internal edges of the connection wells of the other contacts.
Electronic module for a smart card, comprising a substrate having on a first face a terminal block of electrical contacts standardized according to ISO 7816 allowing operation by contact with the corresponding contacts of a smart card reader, and comprising on a second face an antenna and a microelectronic chip protected by an encapsulation zone and provided with a contact communication and a contactless communication interface, the electrical contacts being connected to the chip by conductive wires passing through connection wells, the antenna comprising a plurality of turns located on the periphery of the module and a proximal connection pad and a distal connection pad arranged inside the encapsulation zone and intended to be connected to corresponding terminals of said contactless communication interface of the chip, and the turns of the antenna comprising a localized recess bypassing the distal connection pad and oriented towards the chip, wherein the distal connection pad is located at a small distance d from the edge of the encapsulation zone, and wherein the internal edges of the connection wells of the two contacts closest to the distal connection pad are spread outwards from the module with respect to the internal edges of the connection wells of the other contacts, so as to maximize the space available between the distal connection pad and said connection wells for the passage of the antenna tracks.
Dependencies are inferred from the claim text.