US 2020/0393274 A1 · DESIGN AND FABRICATION OF HIGH DENSITY SENSOR ARRAY

Abstract

A sensor array having a lattice topology includes interconnects having an electrically-conductive layer sandwiched between two dielectric layers, the interconnects defining first-axis interconnects, second-axis interconnects, and interconnect junctions, sensor nodes located on associated interconnect junctions thereby defining an associated first-axis line and second-axis line, a sensor on an associated sensor node, a primary first-axis interconnect interface that is electrically connected to the first-axis interconnects, and a primary second-axis interconnect interface that is electrically connected to the second-axis interconnects. Each sensor node includes a first electrode that is electrically connected to an associated first-axis line, a second electrode that is electrically connected to an associated second-axis line, and a bypass bridge that electrically isolates the associated second-axis line from the associated first-axis line.

Claims20

Dependent claims

A sensor array having a lattice topology, comprising:

a plurality of interconnects comprising an electrically-conductive layer sandwiched between two dielectric layers, the plurality of interconnects defining:
a plurality of first-axis interconnects;
a plurality of second-axis interconnects;
and
a plurality of interconnect junctions;
a plurality of sensor nodes, each disposed on an associated interconnect junction defining an associated first-axis line and second-axis line;
a plurality of sensors, each disposed on an associated sensor node;
a primary first-axis interconnect interface, electrically connected to the plurality of first-axis interconnects;
and
a primary second-axis interconnect interface, electrically connected to the plurality of second-axis interconnects;
wherein each of the plurality of sensor nodes comprises:
a first electrode, electrically connected to an associated first-axis line;
a second electrode, electrically connected to an associated second-axis line;
and
a bypass bridge, electrically isolating the associated second-axis line from the associated first-axis line.

12 more elements

A method of interrogating a sensor in a sensor array having a lattice topology, the sensor array comprising a plurality of interconnects comprising an electrically-conductive layer sandwiched between two dielectric layers defining a plurality of first-axis interconnects, a plurality of second-axis interconnects, and a plurality of interconnect junctions, a plurality of sensor nodes, each disposed on an associated interconnect junction defining an associated first-axis line and second-axis line, a plurality of sensors, each disposed on an associated sensor node, a primary first-axis interconnect interface, electrically connected to the plurality of first-axis interconnects, and a primary second-axis interconnect interface, electrically connected to the plurality of second-axis interconnects, the method comprising performing the steps of:

(a) enabling, with the primary first-axis interconnect interface, one of the plurality of first-axis interconnects;
(b) enabling, with the primary second-axis interconnect interface, one of the plurality of second-axis interconnects;
and
(c) interrogating one of the plurality of sensors corresponding to the enabled first-axis interconnect and the enabled second-axis interconnect.

1 more element

Dependencies are inferred from the claim text.

Design and fabrication of high density sensor array

Life of this patent

Design and fabrication of high density sensor array

Life of this patent

Abstract

Claims20