Pressure sensitive adhesive composition and methods for its preparation and use in flexible organic light emitting diode applications

A pressure sensitive adhesive composition comprising:

• A) 85 to 100 parts by weight of an alkenyl containing polydialkylsiloxane, where the alkenyl containing polydialkylsiloxane has silicon bonded alkyl groups with 1 to 10 carbon atoms and silicon bonded alkenyl groups with 2 to 6 carbon atoms, and where the alkenyl groups are present in an amount >0.3% based on the weight of the alkenyl containing polydialkylsiloxane,
• C) 0.1 to 5 parts by weight of a polyalkylhydrogensiloxane having silicon bonded alkyl groups with 1 to 10 carbon atoms and having, per molecule, an average of at least 1% silicon bonded hydrogen atoms,
• F) an amount of a platinum group metal catalyst sufficient to provide 10 to 5000 ppm concentration of Pt group metal in the composition, and
• E) 0.01 to 0.5 part by weight of an acetylenic alcohol, and
• G) 10% to 90% based on combined weights of all starting materials in the composition of an organic solvent;
• with the proviso that all starting materials in the composition combined have a molar ratio of silicon bonded hydrogen atoms/silicon bonded alkenyl groups (SiH/Alkenyl ratio) of 0.5 to 2.