Methods for packaging a microelectromechanical systems device

Abstract

A method for packaging a MEMS device includes the following steps. A metal cap is provided that is partially anchored to a wafer comprising the MEMS device where at least one point between the cap and the wafer is unanchored, the metal cap arranged to at least substantially extend over the MEMS device. An electrical contact pad is electrically coupled to the MEMS device. A sealing layer is provided over the metal cap and the wafer such that the sealing layer seals a gap between an unanchored portion of the metal cap and the wafer to encapsulate the MEMS device, where the electrical contact pad and the metal cap include the same composition.

Dependencies are inferred from the claim text.