Thermal printhead

A method for manufacturing a thermal printhead that comprises:

• a substrate having an obverse surface;
• a projection formed on the obverse surface and extending in a primary scanning direction;
• a plurality of heating elements arranged in the primary scanning direction on a top of the projection;
• a groove dented from the top of the projection and extending in the primary scanning direction;
• and a heat storage member filling at least an opening of the groove, wherein the projection includes a top surface and a pair of inclined outer surfaces spaced apart from each other via the top surface in a secondary scanning direction, the inclined outer surfaces being inclined with respect to the obverse surface, and the groove includes a pair of inclined inner surfaces each connected to the opening and inclined with respect to the obverse surface, the method comprising:
• preparing a substrate material made of a single-crystal semiconductor material;
• and
• performing anisotropic etching to a predetermined region of an obverse surface of the substrate material to form the projection and the groove.

A method for manufacturing a thermal printhead that comprises:

• a substrate having an obverse surface;
• a projection formed on the obverse surface and extending in a primary scanning direction;
• a plurality of heating elements arranged in the primary scanning direction on a top of the projection;
• a groove dented from the top of the projection and extending in the primary scanning direction;
• and a heat storage member filling at least an opening of the groove, wherein the projection includes a top surface, a pair of first inclined outer surfaces and a pair of second inclined outer surfaces, the second inclined outer surfaces being spaced apart from each other via the top surface in a secondary scanning direction, the first inclined outer surfaces being spaced apart from each other via the top surface and the second inclined outer surfaces in the secondary scanning direction, wherein an inclination angle of the first inclined outer surfaces with respect to the obverse surface is greater than an inclination angle of the second inclined outer surfaces with respect to the obverse surface, wherein the groove includes a pair of first inclined inner surfaces and a pair of second inclined inner surfaces, the first inclined inner surfaces being connected to the opening via the second inclined inner surfaces, the second inclined inner surfaces being connected directly to the opening, an inclination angle of the first inclined inner surfaces with respect to the obverse surface being greater than an inclination angle of the second inclined inner surfaces with respect to the obverse surface, the method comprising:
• preparing a substrate material made of a single-crystal semiconductor material;
• performing anisotropic etching to a predetermined region of an obverse surface of the substrate material to form an intermediate projection and an intermediate groove, the intermediate projection having surfaces to become the first inclined outer surfaces, the intermediate groove having surfaces to become the first inclined inner surfaces;
• and
• performing anisotropic etching to the intermediate projection and the intermediate groove to obtain the projection with the first inclined outer surfaces, the second inclined outer surfaces and the top surface and to obtain the groove with the first inclined inner surfaces and the second inclined inner surfaces.