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US 2020/0370177 A1Published application
Substrate processing chamber
AssigneeApplied Materials, Inc.
InventorsTimothy Joseph FRANKLIN, Adam FISCHBACH, Edward HAYWOOD, Abhijit B. MALLICK, Pramit MANNA, Carlaton WONG, Stephen C. GARNER, Eswaranand VENKATASUBRAMANIAN
Life of this patent
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Abstract
Embodiments of the present disclosure generally relate to apparatus and methods utilized in the manufacture of semiconductor devices. More particularly, embodiments of the present disclosure relate to a substrate processing chamber, and components thereof, for forming semiconductor devices.
Claims20
A process chamber, comprising:
- a lid assembly;
- a chamber body coupled to the lid assembly by a spacer, the spacer and the chamber body defining a resonance cavity;
- a rotatable magnet assembly coupled to the spacer outside of the resonance cavity;
- and
- a substrate support disposed and movable within the resonance cavity, wherein the substrate support is coupled to a facilities cable that flexes based on operation of an actuator coupled to the substrate support.
2 more elements
A process chamber, comprising:
- a lid assembly comprising a showerhead;
- a chamber body coupled to the lid assembly by a spacer, the spacer and the chamber body defining a resonance cavity;
- a magnet assembly coupled to the spacer outside of the resonance cavity;
- and
- a substrate support disposed within the resonance cavity, wherein the substrate support is coupled to a facilities cable and comprises an electrostatic chuck having a puck including a plurality of electrodes.
2 more elements
A process chamber, comprising:
- a lid assembly comprising a showerhead;
- a chamber body coupled to the lid assembly by a spacer, the spacer and the chamber body defining a resonance cavity;
- a magnet assembly coupled to the spacer outside of the resonance cavity;
- and
- a substrate support movably disposed within the resonance cavity, wherein the substrate support is coupled to a facilities cable that includes a single piece conductor including a bend, and wherein the substrate support comprises an electrostatic chuck having a puck including a plurality of electrodes.
2 more elements
Dependencies are inferred from the claim text.