US 2020/0369935 A1 · HEAT-RADIATING SUBSTRATE

Abstract

A heat-radiating substrate according to an embodiment of the present invention comprises: a first metal layer; an insulating layer disposed on the first metal layer and including an epoxy resin and an inorganic filler; and a second metal layer disposed on the insulating layer, wherein the insulating layer comprises: a first region comprising a first surface in contact with the first metal layer; and a second region comprising a second surface in contact with the second metal layer, wherein the inorganic filler comprises a boron nitride aggregate and aluminum oxide, wherein the weight ratio of the aluminum oxide to the total weight of the inorganic filler on the first face is 0.95 to 1.05 times the weight ratio of the aluminum oxide to the total weight of the inorganic filler on the second face.

Claims15

Dependent claims

A heat-radiating substrate comprising:

a first metal layer;
an insulating layer disposed on the first metal layer and including an epoxy resin and an inorganic filler;
and
a second metal layer disposed on the insulating layer,
wherein the insulating layer includes a first region including a first surface in contact with the first metal layer and a second region including a second surface in contact with the second metal layer,
the inorganic filler includes a boron nitride aggregate and aluminum oxide, and
a ratio of a weight of the aluminum oxide to a total weight of the inorganic filler in the first surface is 0.95 to 1.05 times a weight ratio of a weight of the aluminum oxide to a total weight of the inorganic filler in the second surface.

4 more elements

Dependencies are inferred from the claim text.

Heat-radiating substrate

Life of this patent

Heat-radiating substrate

Life of this patent

Abstract

Claims15