A method for the manufacture of a mems device
AssigneeXaar Technology Limited
InventorBruce SCOTT
Life of this patent
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Abstract
A method for the manufacture of a microelectromechanical systems (MEMS) device comprising bonded components which together define a chamber in the device, which method comprises forming a bonding material layer on a surface of a first component, patterning the bonding material layer and, optionally, the first component and bonding a second component to the patterned bonding material layer and first component. The forming of the bonding material layer comprises partially curing a curable material and the bonding of the second component to the patterned bonding material layer and the first component comprises fully curing the partially cured material.
Claims21
-15. (canceled)
A method for the manufacture of a microelectromechanical systems (MEMS) actuated fluidic device comprising bonded components arranged together to define at least one of a fluidic chamber and a fluidic path in the device, the method comprising:
- forming a bonding material layer on a surface of a first component;
- patterning the bonding material layer and the first component;
- and
- bonding a second component to the patterned bonding material layer and the first component,
- wherein:
- the forming of the bonding material layer comprises providing a layer of curable material on the first surface of the first component and partially curing the layer of curable material by heating to a first temperature in an inert atmosphere, and
- the bonding of the second component to the patterned bonding material layer and the first component comprises fully curing the layer of curable material by heating the components to a second temperature higher than the first temperature.
A method for the manufacture of a microelectromechanical systems (MEMS) actuated fluidic device comprising bonded components arranged together to define at least one of a fluidic chamber and a fluidic path in the device, the method comprising:
- forming a bonding material layer on a surface of a first component;
- patterning the bonding material layer;
- and
- bonding a second component to the patterned bonding material layer and the first component,
- wherein:
- the forming of the bonding material layer comprises providing a layer of curable material on the first surface of the first component and partially curing the layer of curable material by heating to a first temperature in an inert atmosphere, and
- the bonding of the second component to the patterned bonding material layer and the first component comprises fully curing the layer of curable material by heating the components to a second temperature higher than the first temperature.
Dependencies are inferred from the claim text.