Light emitting diode module
AssigneeSamsung Electronics Co., Ltd.
InventorsChangjoon LEE, Seongho SON, Jongsung LEE, Youngki JUNG
Life of this patent
Estimating the term…
Abstract
A light emitting diode (LED) module includes an integrated substrate, the integrated substrate including a plurality of LEDs; a glass substrate; and a signal wiring layer provided on the glass substrate. The signal wiring layer includes a plurality of signal electrodes configured to supply a data signal to the plurality of LEDs. The LED module further includes a conductive pattern provided on at least one surface of the integrated substrate, and connected to a ground.
Claims20
A light emitting diode (LED) module, comprising:
- an integrated substrate comprising:
- a plurality of LEDs;
- a glass substrate;
- and
- a signal wiring layer provided on the glass substrate, the signal wiring layer comprising a plurality of signal electrodes configured to supply a data signal to the plurality of LEDs and a plurality of reference electrodes configured to ground the plurality of LEDs;
- and
- a conductive pattern provided on at least one surface of the integrated substrate, and connected to at least one of the plurality of reference electrodes or a ground.
A light emitting diode (LED) module, in which at least one layer is laminated, comprising:
- a glass substrate comprising a pair of surfaces and a plurality of side surfaces surrounding the pair of surfaces;
- an upper layer arranged on the glass substrate so as to fix a plurality of light emitting diodes (LEDs) and comprising an upper signal wiring layer comprising a plurality of signal electrodes configured to supply a data signal to a plurality of LEDs and a plurality of reference electrodes configured to ground the plurality of LEDs;
- a lower layer comprising a lower signal wiring layer connected to the upper signal wiring layer, the lower signal wiring layer provided below the glass substrate;
- a side wiring provided on at least one first surface of the LED module and configured to connect the upper signal wiring layer to the lower signal wiring layer;
- and
- a conductive pattern provided on at least one second surface of the LED module, different from the at least one first surface, the conductive pattern being connected to at least one of the plurality of reference electrodes.
A light emitting diode (LED) module comprising:
- a glass substrate comprising a pair of surfaces and four side surfaces between the pair of surfaces;
- a plurality of light emitting diodes (LEDs) arranged on an upper surface of the glass substrate;
- a signal wiring layer electrically connected to the plurality of LEDs;
- a driving signal wiring layer provided on a lower surface of the glass substrate;
- a side wiring provided on a first side surface of the glass substrate and a second side surface of the glass substrate, the second side surface facing opposite to the first side surface, and the side wiring being configured to electrically connect the signal wiring layer to the driving signal wiring layer;
- and
- a conductive pattern provided on a third side surface of the glass substrate and a fourth side surface of the glass substrate that are different from the first side surface and the second side surface, the third side surface facing opposite to the fourth side surface, and the conductive pattern being connected to a ground.
Dependencies are inferred from the claim text.