Semiconductor package

A semiconductor package comprising:

• a circuit substrate including a plurality of interconnections;
• a first chip on the circuit substrate;
• a second chip stacked on the first chip;
• a plurality of first pads on the circuit substrate, the plurality of first pads overlapping the first chip;
• a plurality of bumps between the circuit substrate and the first chip;
• a plurality of second pads on an edge portion of one side of the circuit substrate and electrically connected to the second chip through a conductive wire;
• an underfill that fills a space between the circuit substrate and the first chip;
• a first dam on the circuit substrate, the first dam overlapping the first chip and blocking a flow of the underfill;
• and
• a second dam outside the first dam, the second dam overlapping the first chip,
• wherein the second dam includes a conductive material and overlaps at least one of the plurality of interconnections.

A semiconductor package, comprising:

• a circuit substrate;
• a first chip on the circuit substrate;
• a plurality of first pads disposed on the circuit substrate and arranged in a first direction;
• a plurality of bumps disposed on the circuit substrate and electrically connecting the circuit substrate and the first chip;
• an underfill that fills a space between the circuit substrate and the first chip;
• and
• a first dam disposed on the circuit substrate and extending in a second direction substantially perpendicular to the first direction, at least a portion of the first dam overlapping the first chip.