Semiconductor package and manufacturing method thereof

A manufacturing method of a semiconductor package, comprising:

• forming a pair of first metal layers side by side on a carrier;
• forming first solder layers on the first metal layers of the pair;
• disposing a pair of semiconductor dies on the carrier, wherein second metal layers and second solder layers are stacked, in order, on rear surfaces of the semiconductor dies of the pair of semiconductor dies, and the pair of semiconductor dies is disposed on the carrier so that the second solder layer formed on a first semiconductor die of the pair of semiconductor dies contacts the first solder layer formed on one first metal layer of the pair of first metal layers, and the second solder layer formed on the second semiconductor die of the pair of semiconductor dies contacts the first solder layer formed on the other first metal layer of the pair of first metal layers;
• and
• soldering together by heating the second solder layers to the first solder layers.

A manufacturing method of a semiconductor package, comprising:

• forming first stacks of metallic layers on rear surfaces of semiconductor dies;
• forming second stacks of metallic layers on a surface on which the semiconductor dies are to be attached;
• disposing the semiconductor dies on the surface on which the semiconductor dies are to be attached with the first stacks contacting the second stacks;
• and
• reflowing the first stacks and the second stacks to attach the semiconductor dies to the surface.