Back to results
US 2020/0350261 A1Published application
Electronic package and substrate structure having chamfers
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsPo-Hao Wang, Chang-Fu Lin, Chun-Tang Lin, Bo-Hao Chang
Life of this patent
Estimating the term…
Abstract
Provided is a substrate structure, including a substrate having at least one chamfer formed on a surface thereof, and a plurality of conductive bodies formed to the substrate. Therefore, a stress generated during the packaging process is alleviated through the chamfer, and the substrate structure is prevented from being cracked. An electronic package employing the substrate structure is also provided.
Claims12
1-14 (canceled)
A substrate structure, comprising:
- a substrate including at least one first chamfer formed on a surface thereof and a recess free from penetrating the substrate;
- and
- a plurality of conductive bodies formed to the substrate.
Dependencies are inferred from the claim text.