Semiconductor device and semiconductor device manufacturing method

A semiconductor device manufacturing method comprising:

• a connection step of electrically connecting a plurality of pin terminals to a circuit unit such that the plurality of pin terminals formed in a rod shape extend in a same direction from the circuit unit including a semiconductor chip;
• after the connection step, an accommodation step of accommodating the circuit unit and first portions of the plurality of pin terminals positioned on a side of the circuit unit in a first cavity of a mold, and inserting second portions of the plurality of pin terminals respectively in a plurality of pin insertion holes of the mold extending from an inner surface of the first cavity;
• after the accommodation step, a molding step of pouring a resin into the first cavity to form a sealing resin portion sealing the circuit unit and the first portions of the plurality of pin terminals, wherein
• in the accommodation step, after inserting the second portions of the plurality of pin terminals respectively into the plurality of pin insertion holes, a pair of slide portions of the mold are caused to protrude from an inner circumference of each pin insertion hole and to sandwich a tip end portion of the second portion of each pin terminal positioned away from the first cavity, thereby forming a plurality of second cavities connected to the first cavity, the plurality of second cavities being surrounded by an outer circumference of a base end portion of the second portion of each pin terminal positioned close to the first cavity, the inner circumference of each pin insertion hole, and the pair of slide portions, and
• in the molding step, the resin is flown into the second cavity to form a plurality of cylindrical covering resin portions respectively covering the base end portions of the second portions of the plurality of pin terminals.