Microjet-Cooled Flanges for Electronic Devices

A flange that is configured to serve as a base plate for and to cool an electronic component, comprising:

• a heat transfer portion with an inner surface, and an opposed outer surface that is configured to be thermally coupled to the electronic component, wherein the heat transfer portion is configured to provide a short, direct path from a primary thermal interface of the electronics component to the inner surface of the heat transfer portion;
• a high-pressure fluid reservoir;
• a fluid inlet in fluid communication with the high-pressure reservoir, the inlet configured to conduct single-phase cooling fluid into the flange;
• a low-pressure fluid reservoir that is in fluid communication with the inner surface of the heat transfer portion;
• a fluid outlet in fluid communication with the low-pressure reservoir, the outlet configured to conduct the fluid out of the flange;
• and
• a plurality of fluid microjet nozzles that are each configured to transmit the fluid from the high pressure reservoir to the low pressure reservoir in the form of jets that are configured to strike the inner surface of the heat transfer portion.