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US 2020/0350232 A1Published application
Semiconductor component, motor vehicle, and method for producing a semiconductor component
AssigneesAudi AG, ABB Schweiz AG
InventorsThomas GRADINGER, Daniele TORRESIN
Life of this patent
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Abstract
A semiconductor component, including a support frame and at least one semiconductor module attached to the support frame, wherein the support frame includes a respective passage (on the edge of which a base plate of the semiconductor module rests, wherein the base plate is soldered to the support frame.
Claims19
A semiconductor component, comprising:
- a support frame and at least one semiconductor module attached to the support frame,
- wherein the support frame further comprises a respective passage, on the edge of which a base plate of the semiconductor module rests, wherein the base plate is soldered to the support frame.
Dependencies are inferred from the claim text.