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US 2020/0350190 A1Published application
Electronic component transfer apparatus
AssigneeNexperia B.V.
InventorsRalph HUYBERS, Johannes Hubertus Antonius VAN DE RIJDT
Life of this patent
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Abstract
A transfer head for an electronic component transfer apparatus and a method therefor. The transfer head includes a first vacuum pipet laterally spaced from a second vacuum pipet with a first pitch therebetween. The first pitch is variable between a first pitch position and a second pitch position.
Claims14
A transfer head for an electronic component transfer apparatus, the transfer head comprising:
- a first vacuum pipet laterally spaced from a second vacuum pipet with a first pitch therebetween;
- the first pitch being variable between a first pitch position and a second pitch position.
A method of transferring an electronic component from a source location to a target location the method comprising:
- providing a transfer head comprising:
- a first vacuum pipet laterally spaced from a second vacuum pipet with a first pitch therebetween;
- wherein the first pitch is variable between a first pitch position and a second pitch position;
- positioning the transfer head at a source location;
- adjusting the first pitch between the first vacuum pipet and second vacuum pipet to correspond to the pitch between first and second electronic components on the source location;
- picking the first and second electronic components from the source location;
- moving the transfer head to a target location;
- adjusting the first pitch between the first vacuum pipet and second vacuum pipet to correspond to the pitch between first and second positions at a target location;
- and
- placing the first and second electronic components at the target locations.
7 more elements
Dependencies are inferred from the claim text.