Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium

A method of manufacturing a semiconductor device comprising:

• (a) placing a substrate in a process chamber;
• (b) supplying a process gas containing a compound capable of reacting with a metal into the process chamber and exhausting an inner atmosphere of the process chamber by a common exhaust piping in communication with the process chamber, a first exhaust piping made of a resin incapable of reacting with the compound and whose one end is connected to the common exhaust piping via a first valve and a first exhauster connected to the first exhaust piping;
• and
• (c) exhausting the inner atmosphere of the process chamber by the common exhaust piping, a second exhaust piping made of the metal and whose one end is connected to the common exhaust piping via a second valve and a second exhauster connected to the second exhaust piping.

A non-transitory computer-readable recording medium storing a program that causes, by a computer, a substrate processing apparatus to perform:

• (a) placing a substrate in a process chamber;
• (b) supplying a process gas containing a compound capable of reacting with a metal into the process chamber and exhausting an inner atmosphere of the process chamber by a common exhaust piping in communication with the process chamber, a first exhaust piping made of a resin incapable of reacting with the compound and whose one end is connected to the common exhaust piping via a first valve and a first exhauster connected to the first exhaust piping;
• and
• (c) exhausting the inner atmosphere of the process chamber by the common exhaust piping, a second exhaust piping made of the metal and whose one end is connected to the common exhaust piping via a second valve and a second exhauster connected to the second exhaust piping.