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US 2020/0347230 A1Published application
Curable polyorganosiloxane composition, cured body obtained by curing said compositions, and electronic device comprising the same
AssigneesDow Silicones Corporation, Dow Toray Co., Ltd.
InventorsTakuya OGAWA, Yungjin PARK, Juyoung YOOK
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Abstract
The present disclosure relates to a light curable, light-heat or light-moisture dually curable, or light-heat-moisture multiple curable polyorganosiloxane composition, which has ease of synthesis, low volatile content, rapid curability, excellent toughness and/or superior optical/physical stability in a variety of fields such as coating materials, encapsulants, sealants and adhesives, a cured body obtained by curing said compositions, and an electronic device comprising the same.
Claims18
A curable polyorganosiloxane composition comprising:
- (A) a siloxane-based polymer having at least one Si-bonded (meth)acryloxy C3-C20 alkyl radical group, and having polysiloxane units and sil-alkylene units formed by hydrosilylation reaction in the same molecule;
- and
- (B) a photoinitiator.
(canceled)
Dependencies are inferred from the claim text.