Polyimide precursor solution and polyimide film using same

Abstract

A polyimide precursor solution containing a reaction product of tetracarboxylic acid anhydride and diamine in a molar ratio of 1:0.93 to 1:0.99. The polyimide precursor solution contains a polyimide precursor having a number average molecular weight of at least 38,000 g/mol and can thus produce a polyimide film having high heat resistance. A polyimide precursor solution having improved storage stability can be provided by quantifying the defoaming properties of the solution and controlling the content of bubbles. Moreover, a polyimide film produced therefrom has a reduced amount of bubbles in the film, and can thus suppress the formation of cracks that can form in an inorganic layer when forming a device.

Dependencies are inferred from the claim text.