Bonding Method

Abstract

A bonding method in which more variety of materials can be bonded than a conventional anodic bonding method includes: a disposing step of disposing an oxygen ion conductor and a bonded material to be bonded to the oxygen ion conductor such that they are brought in contact with each other; a connecting step of connecting the oxygen ion conductor to a negative side of a voltage application device and connecting the bonded material to a positive side of the voltage application device; and a voltage applying step of applying a voltage between the oxygen ion conductor and the bonded material so as to bond the oxygen ion conductor and the bonded material, wherein abutting surfaces of the oxygen ion conductor and the bonded material are processed such that they are in close contact with each other.

Dependencies are inferred from the claim text.