High compressive strength sound attenuation
AssigneeFormulated Materials LLC
InventorJohn Igo
Life of this patent
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Abstract
The present disclosure describes a sound attenuating flooring system. The sound attenuating flooring system has a subfloor, a sound attenuating material overlaying and contacting only a portion of the subfloor, and an overlayment. The sound attenuating material has a first surface and second surface. The first surface is defined by a plurality of outwardly projecting hollow protrusions. The second surface is defined by a plurality of open recesses corresponding to the plurality of outwardly projecting hollow protrusions. The overlayment overlays the second surface of the sound attenuating material.
Claims33
A sound attenuating flooring system comprising:
- a subfloor;
- a sound attenuating material overlaying and contacting only a portion of the subfloor, the sound attenuating material having a first surface and a second surface, the first surface defined by a plurality of outwardly projecting hollow protrusions, and the second surface defined by a plurality of open recesses corresponding to the plurality of outwardly projecting hollow protrusions;
- and
- an overlayment overlaying the second surface of the sound attenuating material.
A sound attenuating flooring system comprising:
- a subfloor;
- a sound attenuating material overlaying and contacting only a portion of the subfloor, the sound attenuating material having a first surface and a second surface, the first surface defined by about 4 outwardly projecting hollow protrusions to about 50 outwardly projecting hollow protrusions per square inch, and the second surface defined by a plurality of open recesses corresponding to outwardly projecting hollow protrusions;
- and
- an overlayment overlaying the second surface of the sound attenuating material.
Dependencies are inferred from the claim text.