Back to results
US 2020/0303584 A1Published application
Method for Producing a Nitrogen-Free Layer Comprising Silicon Carbide
AssigneePSC Technologies, Inc.
InventorSiegmund GREULICH-WEBER
Life of this patent
Estimating the term…
Abstract
The present invention relates to a method for producing a thin nitrogen-free layer of silicon carbide by means of a carbon- and silicon-containing solution or dispersion.
Claims21
1-20. (canceled)
A method for producing a silicon carbide-containing layer, the layer being nitrogen-free, wherein
- (a) in a first method step, a liquid carbon- and silicon-containing solution or dispersion, in particular a SiC precursorsol, is applied to a carrier,
- (b) in a second method step following the first method step (a), the carbon- and silicon-containing solution or dispersion, in particular the SiC precursorsol, is converted to silicon carbide, wherein the carbon- and silicon-containing solution or dispersion is subjected to a multi-stage thermal treatment, wherein
- (i) in a first thermal process stage (i) the carbon- and silicon-containing solution or dispersion, in particular the SiC precursorsol, is heated to temperatures of 300° C. or higher, in particular 300 to 1800° C., preferably 800 to 1000° C., and
- (ii) in a second thermal process stage following the first thermal process stage (i), the carbon- and silicon-containing solution or dispersion, in particular the SiC precursorsol, is heated to temperatures of 1800° C. or higher, in particular 1800 to 2200° C.
1 more element
Dependencies are inferred from the claim text.