US 2020/0288611 A1Published application

Mounting system

AssigneeFuji Corporation

InventorKenji HARA

Life of this patent

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Abstract

A mounting system including a component mounting device configured to mount a component on a surface of a board, and a control device. The component mounting device includes an imaging device to image the surface of the board. The control device stores drawing information depicting the board surface on which the component is to be mounted by the component mounting device, compares a specific position in the stored drawing information with a specific position in image information of the board surface imaged by the imaging device, and recognizes that the planned mounting section of the board surface is not at the predetermined position when the specific position in the drawing information and the specific position in the image information are different.

Claims5

Dependent claims

A mounting system comprising a component mounting device configured to mount a component on a surface of a board, and a control device,

wherein a planned mounting section, at which mounting of a component by the component mounting device is planned, is provided on the surface of the board;
wherein the component mounting device comprises an imaging device, being configured to image the surface of the board, and mounts the component on the planned mounting section when the planned mounting section of the board surface is at a predetermined position, and
wherein the control device stores drawing information depicting the board surface on which the component is to be mounted by the component mounting device, compares a specific position in the stored drawing information with a specific position in image information of the board surface imaged by the imaging device, and recognizes that the planned mounting section of the board surface is not at the predetermined position when the specific position in the drawing information and the specific position in the image information are different.

Dependencies are inferred from the claim text.

Facts

Application: 16/645,107Filed 15 Sep 2017
Published: 10 Sep 2020
Term ends: Not estimatedThe source records don’t support an estimate.

Classification5 codes

H05K 13/081
Monitoring manufacture of assemblages: integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices…
H05K 13/083
Monitoring manufacture of assemblages: quality monitoring using results from monitoring devices, e.g. feedback loops
H05K 13/04
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components: mounting of components , e.g. of…
H05K 13/0812
Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling…

Family

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