Heat dissipation structure
AssigneeASUSTeK COMPUTER INC.
InventorsChun-Chieh WONG, Cheng-Yu WANG
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Abstract
A heat dissipation structure applied to a substrate with a heat generating element is provided. The heat dissipation structure includes a heat dissipation body and an elastomer. The heat dissipation body includes a connecting portion, where the connecting portion includes a central area and a peripheral area, and the central area is configured to contact with the heat generating element. The elastomer is disposed between the peripheral area and the heat generating element, to form a sealed space, and the sealed space is configured to accommodate a heat-conducting medium.
Claims7
A heat dissipation structure, applied to a substrate with a heat generating element, comprising:
- a heat dissipation body, having a connecting portion, wherein the connecting portion comprises a central area and a peripheral area, and the central area is configured to contact with the heat generating element;
- an elastomer, disposed between the peripheral area and the heat generating element, to form a sealed space, wherein the sealed space is configured to accommodate a heat-conducting medium. The heat dissipation structure according to claim 1, wherein the heat generating element comprises a protrusion, and the central area is corresponding to the protrusion.
Dependencies are inferred from the claim text.