Arrangement for dissipating heat of a power supply unit in a housing
AssigneeAppleton Grp LLC
InventorsSantosh K. Patil, Timothy E. Graff
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Abstract
The present disclosure envisages an arrangement (100) for dissipating heat of a power supply unit (105) in a housing (110). The arrangement (100) comprises at least one packing member (120). The packing member (120) is disposed between the power supply unit (105) and an operative inner wall of the housing (110) to increase conductive thermal contact between inner walls of the housing (110) and the power supply unit (105). The arrangement (100) facilitates maximum surface contact between a power supply unit and inner walls of a housing.
Claims15
An arrangement for dissipating heat of a power supply unit in a housing, said arrangement comprising at least one packing member slid between said power supply unit and an operative inner wall of said housing, said arrangement configured to increase conductive thermal contact between at least some of the inner walls of said housing and said power supply unit.
A method of dissipating heat of a power supply unit in a housing, said method comprising the step of inserting a packing member between an inner wall of said housing and said power supply unit to increase conductive thermal contact between inner walls of said housing and said power supply unit.
Dependencies are inferred from the claim text.