Solder mask
AssigneePicosun Oy
InventorMarko PUDAS
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Abstract
A method for formation of a patterned solder mask (10) on a substrate is provided, in which method the mask is deposited by a process of chemical deposition in vapor phase. A method for manufacturing a printed circuit board and/or an electronic component comprising formation of said patterned solder mask is further provided.
Claims14
A method for formation of a patterned solder mask layer (10) on a substrate (11) comprising apertures and/or non-planar surfaces by a process of chemical deposition in vapor phase, wherein mask patterning is implemented via lift-off patterning with water-soluble lift-off material (21).
A method for manufacturing a printed circuit board and/or an electrical component comprising depositing a patterned solder mask layer (10) onto an underlying substrate (11), optionally, onto a conductive material (2) by a process of chemical deposition in vapor phase, said substrate comprising apertures and/or non-planar surfaces, wherein patterning is implemented via lift-off patterning with water-soluble lift-off material (21).
Dependencies are inferred from the claim text.