Base material for printed circuit board and printed circuit board

A printed circuit board comprising:

• an insulating base film;
• a sintered layer that is layered on at least one side surface of the base film and that is found of a plurality of sintered metal particles;
• an electroless plating layer that is layered on a surface of the sintered layer that is opposite to the base film;
• an electroplating layer that is layered on a surface of the electroless plating layer that is opposite to the sintered layer,
• wherein the sintered layer, the electroless plating layer, and the electroplating layer are patterned in plan view, and
• wherein an arithmetic mean height Sa of the surface of the electroless plating layer opposite to the sintered layer is greater than or equal to 0.001 μm and less than or equal to 0.5 μm.