Multilayer substrate, multilayer substrate mounting structure, method of manufacturing multilayer substrate, and method of manufacturing electronic device

A multilayer substrate mounting structure comprising:

• a multilayer substrate;
• and
• a mounting substrate on which the multilayer substrate is mounted, the mounting substrate including a mounting surface and a bonding electrode on the mounting surface;
• wherein
• the multilayer substrate includes:
• a stacked body including a plurality of insulating base material layers made of a resin as a main material and stacked on one another, and including a main surface;
• and
• a conductor pattern including:
• a mounting electrode provided on the main surface;
• and
• a first auxiliary pattern provided on the main surface and located adjacent to or in a vicinity of the mounting electrode;
• the mounting electrode, in a plan view of the main surface, is interposed between a first portion of the first auxiliary pattern, and a second portion of the first auxiliary pattern or a different conductor pattern;
• three out of four directions of the mounting electrode are surrounded by the first auxiliary pattern, the four directions being perpendicular or substantially perpendicular to a radial direction from the mounting electrode;
• the first auxiliary pattern is not electrically connected to the bonding electrode;
• and
• the mounting electrode is electrically connected to the bonding electrode.

A method of manufacturing a multilayer substrate including a stacked body including a plurality of insulating base material layers made of a resin as a main material and stacked on one another, and including a main surface;

• and a conductor pattern including:
• a mounting electrode provided on the main surface, and a first auxiliary pattern provided on the main surface, the method comprising:
• a conductor pattern forming step of forming the mounting electrode, and the first auxiliary pattern located adjacent to or in a vicinity of the mounting electrode, on a surface of an insulating base material layer defining and functioning as the main surface, among the plurality of insulating base material layers;
• and
• a stacked body forming step of forming the stacked body by stacking the plurality of insulating base material layers and heating and pressing the stacked insulating base material layers, after the conductor pattern forming step, wherein
• the mounting electrode is interposed between a first portion of the first auxiliary pattern, and a second portion of the first auxiliary pattern or a different conductor pattern;
• and
• three out of four directions of the mounting electrode are surrounded by the first auxiliary pattern, the four directions being perpendicular or substantially perpendicular to a radial direction from the mounting electrode.

A method of manufacturing an electronic device including a multilayer substrate, and a mounting substrate including a mounting surface, and a bonding electrode on the mounting surface, wherein the multilayer substrate includes a stacked body including a plurality of insulating base material layers made of a resin as a main material and stacked on one another, and including a main surface;

• and a conductor pattern including a mounting electrode provided on the main surface;
• and a first auxiliary pattern provided on the main surface and located adjacent to or in a vicinity of the mounting electrode;
• the mounting electrode, in a plan view of the main surface, is interposed between a first portion of the first auxiliary pattern, and a second portion of the first auxiliary pattern or a different conductor pattern;
• and three out of four directions of the mounting electrode are surrounded by the first auxiliary pattern, the four directions being perpendicular or substantially perpendicular to a radial direction from the mounting electrode, the method comprising:
• an anisotropic element placing step of placing an insulating anisotropic conductive film on a surface of the bonding electrode being a convex portion protruding than at least other portions of the mounting surface;
• a multilayer substrate placing step of stacking the multilayer substrate on the mounting surface of the mounting substrate so that the mounting electrode may face the bonding electrode while interposing the insulating anisotropic conductive film between the multilayer substrate and the mounting substrate, after the anisotropic element placing step;
• and
• a heating and pressing step of heating and pressing the multilayer substrate and the mounting substrate in a direction in which the multilayer substrate and the mounting substrate are stacked on each other and electrically connecting the mounting electrode and the bonding electrode, after the multilayer substrate placing step.