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US 2020/0288571 A1Published application
Multi-socket server assembly
AssigneeCisco Technology, Inc.
InventorsAnant Thakar, Jayaprakash Balachandran, Daniel Bernard Hruska
Life of this patent
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Abstract
In some examples, a printed circuit board assembly can include a printed circuit board having four (4) central processor unit (CPU) sockets disposed thereon and sixty four (64) dual in-line memory modules (DIMMs) disposed thereon. The printed circuit board can have a top surface and a bottom surface with two (2) CPU sockets and thirty two (32) DIMMs disposed on the top surface and two (2) CPU sockets and thirty two (32) DIMMs disposed on the bottom surface.
Claims20
A printed circuit board comprising:
- a top surface and a bottom surface;
- a plurality of processor sockets disposed on the printed circuit board;
- a first plurality of dual in-line memory modules (DIMMs) disposed on the top surface;
- and
- a second plurality of DIMMs disposed on the bottom surface;
- wherein a first contact area of each DIMM in the first plurality of DIMMs and a second contact area of each DIMM in the second plurality of DIMMs have a respective overlapping alignment along a vector that is perpendicular to a plane of the printed circuit board, wherein each pair of DIMMs associated with the first contact area and the second contact area having the respective overlapping alignment is connected to a respective processor through a single via.
3 more elements
A system assembly comprising:
- a housing;
- and
- a printed circuit board within the housing, the printed circuit board comprising:
- a top surface and a bottom surface;
- a plurality of processor sockets disposed on the printed circuit board;
- a first plurality of dual in-line memory modules (DIMMs) disposed on the top surface;
- and
- a second plurality of DIMMs disposed on the bottom surface;
- wherein a first contact area of each DIMM in the first plurality of DIMMs and a second contact area of each DIMM in the second plurality of DIMMs have a respective overlapping alignment along a vector that is perpendicular to a plane of the printed circuit board, wherein each set of DIMMs associated with the first contact area and the second contact area having the respective overlapping alignment is connected to a respective processor through a single via.
6 more elements
Dependencies are inferred from the claim text.