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US 2020/0288570 A1Published application
Circuit Board with Improved Thermal, Moisture Resistance, and Electrical Properties
AssigneeOSI Electronics, Inc.
InventorsRobert Jung, Konstantine Karavakis
Life of this patent
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Abstract
A circuit board with improved reliability and ability to withstand sonication, autoclave sterilization, moisture exposure and high pH solution exposure. The circuit board has a substrate made of a liquid crystal polymer, one or more vias extending through the substrate, conductive traces positioned on surfaces of the substrate, and cover layers made of liquid crystal polymer material positioned over surfaces of the substrate.
Claims20
A circuit board comprising:
- a substrate comprising a first liquid crystal polymer and two opposing sides, wherein the first of the two opposing sides defines a first surface layer and wherein the second of the two opposing sides defines a second surface layer;
- one or more vias extending through the substrate and two opposing sides, wherein each of the one or more vias comprises conductive material;
- a plurality of conductive traces positioned on at least one of the two opposing sides;
- a first adhesive positioned on the first surface layer;
- a second adhesive positioned on the second surface layer;
- a first cover layer positioned over the first adhesive on the first surface layer, wherein the first cover layer comprises a second liquid crystal polymer;
- and
- a second cover layer positioned over the second adhesive on the second surface layer, wherein the second cover layer comprises a third liquid crystal polymer.
5 more elements
A circuit board comprising:
- a liquid crystal polymer substrate defined by a thickness of 25 to 75 microns and including two opposing sides, wherein the first of the two opposing sides defines a first surface layer and wherein the second of the two opposing sides defines a second surface layer;
- one or more vias extending through the substrate and two opposing sides, wherein each of the one or more vias comprises at least one of conductive material or material plated to one or more walls of each of the one or more vias;
- a plurality of conductive traces positioned on at least one of the two opposing sides, wherein each of the one or more vias is configured to interconnect one of the plurality of conductive traces on the first surface layer with another one of the plurality of conductive traces on the second surface layer;
- a first adhesive positioned on the first surface layer, wherein the adhesive covers all of the first surface layer;
- a second adhesive positioned on the second surface layer, wherein the adhesive covers all of the second surface layer;
- a first cover layer positioned over the first adhesive on the first surface layer, wherein the first cover layer comprises a second liquid crystal polymer;
- and
- a second cover layer positioned over the second adhesive on the second surface layer, wherein the second cover layer comprises a third liquid crystal polymer.
5 more elements
Dependencies are inferred from the claim text.