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US 2020/0288569 A1Published application
Circuit Board with Improved Thermal, Moisture Resistance, and Electrical Properties
AssigneeOSI Electronics, Inc.
InventorsRobert Jung, Konstantine Karavakis
Life of this patent
Estimating the term…
Abstract
A circuit board with improved reliability and ability to withstand sonication, autoclave sterilization, moisture exposure and high pH solution exposure. The circuit board has a substrate made of a liquid crystal polymer, one or more vias extending through the substrate, conductive traces positioned on surfaces of the substrate, and cover layers positioned over surfaces of the substrate.
Claims21
A circuit board comprising:
- a substrate comprising a liquid crystal polymer, a first side and second side opposite said first side, wherein the first side defines a first conducting layer, and wherein the second side defines a second conducting layer;
- a first cover layer positioned over the first conducting layer, wherein the first cover layer comprises a first bond ply having a first hydrocarbon base sandwiched between a first adhesive layer and a second adhesive layer;
- and
- a second cover layer positioned over the second conducting layer, wherein the second cover layer comprises a second bond ply having a second hydrocarbon base sandwiched between a third adhesive layer and a fourth adhesive layer.
1 more element
A circuit board comprising:
- a substrate comprising a liquid crystal polymer, a first side and a second side opposite said first side, wherein the first side defines a first conducting layer, and wherein the second side defines a second conducting layer;
- a first cover layer positioned over the first conducting layer, wherein the first cover layer comprises a partially cured first adhesive;
- and
- a second cover layer positioned over the second conducting layer, wherein the second cover layer comprises a partially cured second adhesive.
1 more element
A circuit board comprising:
- a substrate comprising a liquid crystal polymer, a first side and an opposing second side, wherein the first side defines a first conducting layer, and wherein the second side defines a second conducting layer;
- a first cover layer positioned over the first conducting layer, wherein the first cover layer comprises a first solder mask;
- and
- a second cover layer positioned over the second conducting layer, wherein the second cover layer comprises a second solder mask.
1 more element
(canceled)
Dependencies are inferred from the claim text.