Production of optoelectronic components

A method for producing optoelectronic components, comprising:

• provision of a metal carrier, the carrier comprising a front side and a rear side opposite to the front side;
• front-side removal of carrier material, so that the carrier comprises carrier sections protruding in the region of the front side and depressions arranged between them;
• formation of a plastic body adjoining carrier sections;
• arranging of optoelectronic semiconductor chips on carrier sections;
• rear-side removal of carrier material in the region of the depressions, so that the carrier is structured into separate carrier sections;
• and
• carrying out singulation, the plastic body being severed between separate carrier sections and singulated optoelectronic components comprising at least one optoelectronic semiconductor chip being formed,
• wherein prestructuring of the carrier is carried out by the front-side removal of carrier material, the formation of the plastic body is carried out on the prestructured carrier, and the rear-side removal of carrier material in order to structure the carrier into separate carrier sections is carried out after the formation of the plastic body.

An optoelectronic component, comprising:

• a plurality of separate metal carrier sections;
• a plastic package body adjoining the carrier sections;
• and
• at least one optoelectronic semiconductor chip, which is arranged on at least one carrier section,
• wherein a circumferential lateral surface of the optoelectronic component is formed exclusively by the plastic package body.