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US 2020/0287104 A1Published application
Package
AssigneeLextar Electronics Corporation
InventorsShiou-Yi KUO, Jian-Chin LIANG, Yu-Chun LEE, Fu-Hsin CHEN, Jo-Hsiang CHEN, Chien-Nan YEH
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Abstract
A package includes a substrate and a plurality of light-emitting chips. The substrate has a top surface. The light-emitting chips are disposed on the top surface of the substrate, in which a sum of the vertical projection areas of the light-emitting chips on the top surface of the substrate is less than 5% of an area of the top surface of the substrate.
Claims11
A package, comprising:
- a substrate having a top surface;
- and
- a plurality of light emitting chips disposed on the top surface of the substrate, wherein a sum of vertical projection areas of the light emitting chips on the top surface is less than 5% of an area of the top surface.
A package, comprising:
- a substrate having a top surface and a bottom surface opposite to the top surface;
- a plurality of light emitting chips disposed on the top surface of the substrate, wherein each of the light emitting chips has an upper surface;
- and
- a package layer covering the top surface of the substrate and the upper surface of each of the light emitting chips, wherein the package layer has a top surface, a ratio of a distance between the top surface of the substrate and the upper surface of each of the light emitting chips to a distance between the bottom surface of the substrate and the top surface of the package layer is less than 0.1.
1 more element
Dependencies are inferred from the claim text.