Light emitting device and method of manufacturing the light emitting device

A light emitting device comprising:

• a package having an upward-opening recess;
• at least one light-emitting element disposed in the recess;
• a holding member defining an opening disposed at an upper surface side of the package and partially covering an opening of the recess;
• a light-transmissive member having a lower surface and covering the opening defined by the holding member;
• an antireflection film disposed on the lower surface of the light-transmissive member, the antireflection film located between the lower surface of the light-transmissive member and an upper surface of the holding member at a location where a portion of the lower surface of the light-transmissive member is bonded to the upper surface of the holding member via the antireflection film;
• and
• a coating film disposed on at least a portion of outer surfaces of the light emitting device, the portion includes a region where the antireflection film between the lower surface of the light-transmissive member and the upper surface of the holding member is exposed to environmental air.

A method of manufacturing a light emitting device, the method comprising:

• providing a light-emitting element package, the light-emitting element package including
• a package having an upper surface, a portion of the upper surface defining an upward-opening recess,
• at least one light-emitting element disposed in the recess,
• a light-transmissive member having a lower surface, a portion of the lower surface being bonded to the upper surface of the package and covering the opening of the recess, and
• an antireflection film disposed on the lower surface of the light-transmissive member and located between the lower surface of the light-transmissive member and the upper surface of the package at a location where a portion of the lower surface of the light-transmissive member is bonded to the upper surface of the package;
• and
• disposing a coating film on at least a portion of outer surfaces of the light-emitting element package, the portion including a region where the antireflection film located between the lower surface of the light-transmissive member and the upper surface of the package is exposed.

A method of manufacturing a light emitting device, the method comprising:

• providing a light-emitting element package, the light-emitting element package including
• a package having an upward-opening recess,
• at least one light-emitting element disposed in the recess,
• a holding member defining an opening disposed at an upper surface side of the package and partially covering an opening of the recess,
• a light-transmissive member covering the opening of the holding member, and
• an antireflection film disposed on a lower surface of the light-transmissive member, the antireflection film located between the lower surface of the light-transmissive member and an upper surface of the package at a location where a portion of the lower surface of the light-transmissive member is bonded to the upper surface of the package via the antireflection film;
• and
• disposing a coating film on at least a portion of outer surfaces of the light-emitting element package, the portion including a region where the antireflection film located between the lower surface of the light-transmissive member and the upper surface of the holding member is exposed to environmental air.