Semiconductor chips and method for producing semiconductor chips

A semiconductor chip comprising:

• a carrier;
• and
• a semiconductor body arranged thereon, wherein:
• the semiconductor body comprises a first semiconductor layer facing toward the carrier, a second semiconductor layer facing away from the carrier, and an active zone arranged between the first semiconductor layer and the second semiconductor layer;
• at least one current spreading layer configured for electrical contacting of the first semiconductor layer is arranged between the carrier and the semiconductor body, the current spreading layer having a vertical layer thickness of at least 500 nm;
• a metal layer for electrical contacting of the second semiconductor layer is arranged between the carrier and the current spreading layer, the metal layer fully covering the current spreading layer;
• an insulation layer is arranged in the vertical direction between the current spreading layer and the metal layer, the insulation layer fully covering the current spreading layer and electrically insulating the metal layer from the current spreading layer;
• and
• the insulation layer or the metal layer comprises a planarized surface facing away from the semiconductor body;
• the insulation layer comprises a sublayer and a further sublayer, wherein the sublayer is arranged in the vertical direction between the semiconductor body and the further sublayer;
• and
• the sublayer and the further sublayer are configured in respect of their material composition in such a way that the sublayer is configured to be more etching-resistant and/or more polishing-resistant than the further sublayer.