Method for manufacturing light-emitting element

A method for manufacturing a light-emitting element, the method comprising:

• providing a wafer comprising:
• a substrate having a first surface and a second surface, and
• a semiconductor structure provided at the first surface;
• irradiating a laser beam into an interior of the substrate from a second surface side of the substrate, which comprises:
• forming a plurality of first modified regions in the interior of the substrate by scanning the laser beam at a first irradiation pitch along a first direction parallel to the second surface,
• subsequently, forming a plurality of second modified regions in the interior of the substrate between the second surface and the first modified regions by scanning the laser beam at a second irradiation pitch along the first direction, the second irradiation pitch being wider than the first irradiation pitch, and
• subsequently, forming a plurality of third modified regions in the interior of the substrate at a depth within a range of the second modified regions by scanning the laser beam at a third irradiation pitch along the first direction, an output of the laser beam in the step of forming the plurality of third modified regions being higher than an output of the laser beam in the step of forming the plurality of second modified regions, the third irradiation pitch being narrower than the second irradiation pitch;
• and
• subsequently, separating the wafer into a plurality of light-emitting elements.