Semiconductor device and semiconductor device manufacturing method
AssigneeMitsubishi Electric Corporation
InventorsRyu KAMIBABA, Tetsuo TAKAHASHI, Akihiko FURUKAWA
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AssigneeMitsubishi Electric Corporation
InventorsRyu KAMIBABA, Tetsuo TAKAHASHI, Akihiko FURUKAWA
Estimating the term…
A semiconductor device that includes transistor and diode regions in one semiconductor substrate achieves favorable tolerance during recovery behaviors of diodes. A semiconductor base includes an n−-type drift layer in the IGBT and diode regions. In the IGBT region, the semiconductor base includes a p-type base layer formed on the n−-type drift layer, a p+-type diffusion layer and an n+-type emitter layer formed selectively on the p-type base layer, the diffusion layer having a higher p-type impurity concentration than the p-type base layer, and gate electrodes facing the p-type base layer via a gate insulating film. In the diode region, the semiconductor base includes a p−-type anode layer formed on the n−-type drift layer. The p+-type diffusion layer has a higher p-type impurity concentration than the p−-type anode layer, and has a smaller depth and a lower p-type impurity concentration as approaching the diode region.
A semiconductor device comprising:
Dependencies are inferred from the claim text.