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US 2020/0287002 A1Published application
Semiconductor compound, semiconductor device and laminate having layer of semiconductor compound, and target
AssigneesAGC Inc., Tokyo Institute of Technology
InventorsHideo HOSONO, Junghwan Kim, Joonho Bang, Hideya Kumomi, Satoru Watanabe, Kazuto Ohkoshi, Naomichi Miyakawa, Nao Ishibashi, Kunio Masumo, Nobuhiro Nakamura
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