Stacked Electronic Structure
AssigneeCyntec Co., Ltd.
InventorsBau-Ru Lu, Jianhong Zeng, Chun Hsien Lu
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Abstract
A stacked electronic structure comprises: a substrate and a magnetic device, wherein electronic devices and conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the electronic devices, and the magnetic device is disposed over and electrically connected to the conductive pillars, wherein at least one recess or groove can be formed on the bottom surface of the conductive pillar, such as copper pillar, to help the venting of the soldering material as well as to increase the soldering area.
Claims20
A stacked electronic structure, comprising:
- a substrate, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein at least one first recess is formed on a bottom surface of a first conductive pillar of the plurality of conductive pillars, and a soldering material is disposed on a top surface of the substrate and filled into said at least one first recess, and wherein at least one second recess is formed on a bottom surface of a second conductive pillar of the plurality of conductive pillars, and a soldering material is disposed on a top surface of the substrate and filled into said at least one second recess;
- and
- a magnetic device, disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first electrode of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second electrode of the magnetic device is disposed over and electrically connected to a second conductive pillar.
The stacked electronic structure as claimed in claim 11, wherein the first metal layer and the second metal layer are joint by a soldering material.
A stacked electronic structure, comprising:
- a substrate, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein a first metal layer encapsulates the plurality of electronic devices, wherein a molding body encapsulates the plurality of conductive pillars and the first metal layer, wherein a top surface of each of the conductive pillars and a top surface of the first metal layer are exposed from the top surface of the molding body;
- and
- a magnetic device, disposed over the molding body, the metal layer and the plurality of conductive pillars, wherein a first electrode of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second electrode of the magnetic device is disposed over and electrically connected to a second conductive pillar, wherein a second metal layer encapsulates a top surface and a plurality of side surfaces of the magnetic device, and the first metal layer is disposed over and electrically connected to the second metal layer.
A stacked electronic structure, comprising:
- a substrate, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein a metal layer encapsulates the plurality of electronic devices, wherein a molding body encapsulates the plurality of conductive pillars and the metal layer, wherein a top surface of each of the conductive pillars and a top surface of the metal layer are exposed from the top surface of the molding body;
- and
- a magnetic device, disposed over the molding body, the metal layer and the plurality of conductive pillars, wherein a first electrode of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second electrode of the magnetic device is disposed over and electrically connected to a second conductive pillar, and wherein the metal layer is electrically connected to a third conductive pillar.
Dependencies are inferred from the claim text.