US 2020/0286935 A1 · IMAGING PANEL AND PRODUCTION METHOD THEREOF

Abstract

An imaging panel includes a photoelectric conversion layer. The surface of the photoelectric conversion layer is partly covered with an inorganic insulating film having a first opening above the photoelectric conversion layer. An organic insulating film having a second opening having a larger opening width than the first opening is disposed on the inorganic insulating film. A surface of the inorganic insulating film that is not covered with the organic insulating film is covered with the protection film at the inside of the second opening. The etching rate of the protection film upon etching with an etchant containing an acid is equal to or higher than that of the inorganic insulating film. The surface of the photoelectric conversion layer at the first opening and the surface of the protection film are covered with an electrode.

Claims8

Dependent claims

An imaging panel comprising:

a photoelectric conversion layer;
an inorganic insulating film partly covering a surface of the photoelectric conversion layer and having a first opening at a position that overlaps the photoelectric conversion layer in plan view;
an organic insulating film partly covering a surface of the inorganic insulating film and having a second opening that overlaps the first opening in plan view and that has a larger opening width than the first opening;
a protection film covering a portion of the inorganic insulating film, the portion being not covered with the organic insulating film, at an inside of the second opening;
and
an electrode covering the protection film and a surface of the photoelectric conversion layer at an inside of the first opening,
wherein the protection film has an etching rate equal to or higher than that of the inorganic insulating film upon etching with an etchant containing an acid.

4 more elements

A method for producing an imaging panel, comprising:

forming a photoelectric conversion layer on a substrate;
forming an inorganic insulating film on the photoelectric conversion layer;
forming an organic insulating film on the inorganic insulating film and forming an opening of the organic insulating film at a position that overlaps the photoelectric conversion layer in plan view;
forming a protection film covering surfaces of the inorganic insulating film and the organic insulating film;
forming a contact hole that overlaps the photoelectric conversion layer in plan view, has an opening width smaller than that of the opening of the organic insulating film, and extends through the inorganic insulating film and the protection film;
and
forming an electrode covering a surface of the photoelectric conversion layer at the contact hole and partly covering a surface of the protection film,
wherein the protection film has an etching rate equal to or higher than that of the inorganic insulating film upon etching with an etchant containing an acid, and
the contact hole is formed by etching the inorganic insulating film and the protection film using the etchant.

6 more elements

Dependencies are inferred from the claim text.

Imaging panel and production method thereof

Life of this patent

Imaging panel and production method thereof

Life of this patent

Abstract

Claims8