Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof

A method for manufacturing a photosensitive assembly of a camera module, comprising following steps:

• fixing a circuit board jointed panel to a second die of a molding die, wherein the circuit board jointed panel includes one or more rows of circuit boards, and each row of the circuit boards includes one or more circuit boards arranged side by side, each of the circuit boards includes a rigid region and a flexible region combined with each other, and each of the circuit boards is operatively connected with a photosensitive element;
• clamping the second die and a first die, and filling a molten molding material in a base jointed panel molding guide groove in the molding die, wherein a position corresponding to at least one light window molding portion is prevented from filling with the molding material;
• and
• curing the molding material in the base jointed panel molding guide groove to form a one-piece molding base at a position corresponding to the base jointed panel molding guide groove, wherein the one-piece molding base is integrally molded on corresponding one or more rows of the circuit board and one or more rows of the photosensitive elements to form a photosensitive assembly jointed panel and forms a light window that provides a light path for each of the photosensitive elements at a position corresponding to the light window molding portion, wherein the base jointed panel molding guide groove has a first diversion groove corresponding to a first end side of the one-piece molding base adjacent to the flexible region and a second diversion groove corresponding to the one-piece molding base away from the flexible region, and a plurality of the filling grooves extending between the first diversion groove and the second diversion groove, wherein the first diversion groove has a first side surface facing the light window, the second diversion groove has a second side surface facing the light window, wherein the first side surface includes a first partial surface provided adjacent to the photosensitive element and a second partial surface connected to the first partial surface, and the second side surface has a third partial surface provided adjacent to the photosensitive element and a fourth partial surface connected to the third partial surface, wherein a first angle of the first partial surface relative to an optical axis of the camera module is greater than a second angle of the second partial surfaces relative to the optical axis, and a third angle of the third partial surface relative to the optical axis is greater than a fourth angle of the fourth partial surface relative to the optical axis.

A photosensitive assembly, comprising:

• a circuit board
• a photosensitive element, which is operatively connected to the circuit board;
• and
• a molding base, which is integrally molded with the circuit board and the photosensitive element and forms a light window, wherein the molding base has one or more first portion inner surfaces adjacent to the photosensitive element and one or more second partial inner surfaces connected to the first portion inner surface away from the photosensitive element, wherein there is an included angle α between the first portion inner surface and an optical axis of the photosensitive assembly, there is an included angle β between the second portion inner surface and the optical axis of the photosensitive assembly, wherein β<α.