Semiconductor device
AssigneeToshiba Memory Corporation
InventorHiroshi Noguchi
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AssigneeToshiba Memory Corporation
InventorHiroshi Noguchi
Estimating the term…
A semiconductor device according to an embodiment includes a semiconductor substrate, a plurality of conductive layers extending in a first direction on the semiconductor substrate, and laminated in a third direction perpendicular to the first direction and a second direction at intervals in the second direction perpendicular to the first direction, and a passivation film which has several layers provided above the plurality of conductive layers. The passivation film has a first nitride film provided above the plurality of conductive layers, and a second nitride film provided on the first nitride film, and the second nitride film has the concave and convex shape which is repeated along the second direction.
A semiconductor device comprising:
Dependencies are inferred from the claim text.