Semiconductor device
AssigneeToshiba Memory Corporation
InventorsShizuka KUTSUKAKE, Hiroshi MATSUMOTO, Hiroto SAITO
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AssigneeToshiba Memory Corporation
InventorsShizuka KUTSUKAKE, Hiroshi MATSUMOTO, Hiroto SAITO
Estimating the term…
A semiconductor device includes a substrate, a first insulating layer, a second insulating layer above the first insulating layer, a void space between the first and second insulating layers, and contact electrodes extending through the first insulating layer, the void space, and the second insulating layer. Each of the contact electrodes includes a first end facing the substrate, a second end opposite to the first end, and a first width portion between the first end and the second end. The first width portion has a width in a second direction parallel to the substrate that is greater than a width of the first end in the second direction and a width of the second end in the second direction. The first width portion is within the void space.
A semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.